收藏本站
PX3511A, PX3511B
driver current can be estimated with Equations 2 and 3,
respectively,
UVCC
BOOT
D
Q G1 ? UVCC 2
P Qg_Q1 = --------------------------------------- ? F SW ? N Q1
Q G2
P Qg_Q2 = -------------------------------------- ? F SW ? N Q2
P Qg_TOT = P Qg_Q1 + P Qg_Q2 + I Q ? VCC
V GS1
? LVCC 2
V GS2
(EQ. 2)
R HI1
R LO1
PHASE
G
R G1
C GD
R GI1
C GS
S
C DS
Q1
I DR = ? ? ? F SW + I Q
? Q G1 ? UVCC ? N Q1 Q G2 ? LVCC ? N Q2 ?
FIGURE 3. TYPICAL UPPER-GATE DRIVE TURN-ON PATH
------------------------------------------------------ + -----------------------------------------------------
? V GS1 V GS2 ?
(EQ. 3)
where the gate charge (Q G1 and Q G2 ) is defined at a
particular gate to source voltage (V GS1 and V GS2 ) in the
LVCC
C GD
D
corresponding MOSFET datasheet; I Q is the driver ’s total
quiescent current with no load at both drive outputs; N Q1
and N Q2 are number of upper and lower MOSFETs,
R HI2
R LO2
G
R G2
R GI2
C DS
respectively; UVCC and LVCC are the drive voltages for
both upper and lower FETs, respectively. The I Q* VCC
product is the quiescent power of the driver without
C GS
S
Q2
capacitive load and is typically 116mW at 300kHz.
The total gate drive power losses are dissipated among the
resistive components along the transition path. The drive
resistance dissipates a portion of the total gate drive power
losses, the rest will be dissipated by the external gate
resistors (R G1 and R G2 ) and the internal gate resistors
(R GI1 and R GI2 ) of MOSFETs. Figures 3 and 4 show the
typical upper and lower gate drives turn-on transition path.
The power dissipation on the driver can be roughly
estimated as:
FIGURE 4. TYPICAL LOWER-GATE DRIVE TURN-ON PATH
Layout Considerations
For heat spreading, place copper underneath the IC whether
it has an exposed pad or not. The copper area can be
extended beyond the bottom area of the IC and/or
connected to buried copper plane(s) with thermal vias. This
combination of vias for vertical heat escape, extended
copper plane, and buried planes for heat spreading allows
P DR_UP = ? -------------------------------------- + ---------------------------------------- ? ? ---------------------
? R HI1 + R EXT1 R LO1 + R EXT1 ?
P DR_LOW = ? -------------------------------------- + ---------------------------------------- ? ? ---------------------
? R HI2 + R EXT2 R LO2 + R EXT2 ?
P DR = P DR_UP + P DR_LOW + I Q ? VCC
? R HI1 R LO1 ? P Qg_Q1
? R HI2 R LO2 ? P Qg_Q2
2
2
(EQ. 4)
the IC to achieve its full thermal potential.
Place each channel power component as close to each
other as possible to reduce PCB copper losses and PCB
parasitics: shortest distance between DRAINs of upper FETs
and SOURCEs of lower FETs; shortest distance between
DRAINs of lower FETs and the power ground. Thus, smaller
amplitudes of positive and negative ringing are on the
switching edges of the PHASE node. However, some space
R EXT1 = R G1 + -------------
N
R EXT2 = R G2 + -------------
N
R GI1
Q1
8
R GI2
Q2
in between the power components is required for good
airflow. The traces from the drivers to the FETs should be
kept short and wide to reduce the inductance of the traces
and to promote clean drive signals.
FN6462.0
February 26, 2007
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
PXD303/050/01/1 POWER STRIP 10A 2M CORD 5OUTLETS
QW-4PLCC44 ADAPTER QUICKWRITER 4GANG 44PLCC
QW-4SO8/14N ADAPT QUICKWRTR 4GANG 8/14SOIC N
QW-4SO8/14W ADAPT QUICKWRTR 4GANG 8/14SOIC W
QW-4SOIC18 ADAPTER QUICKWRITER 4GANG 18SOIC
QW-4SOIC28 ADAPTER QUICKWRITER 4GANG 28SOIC
QW1 PROGRAMMER PIC MCU QUICKWRITER
R0K502M12S000BE BOARD FOR R8C/M12A
相关代理商/技术参数
PX3511BDDG-RA 功能描述:IC DRVR SYNC BUCK HF 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:*
PX3511D 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Advanced Synchronous Rectified Buck MOSFET Driver with Protection Features
PX3511DDDG-RA 功能描述:IC DRVR SYNC BUCK HF 10-DFN RoHS:是 类别:集成电路 (IC) >> PMIC - MOSFET，电桥驱动器 - 外部开关 系列:- 标准包装:6,000 系列:*
PX3515BDDGR4XTMA1 制造商:Infineon Technologies AG 功能描述: 制造商:Infineon Technologies AG 功能描述:LV IC - Tape and Reel
PX3515BDDGR4XUMA1 制造商:Infineon Technologies AG 功能描述:LV IC - Tape and Reel
PX3516ADDG-R4 功能描述:功率驱动器IC Sync Rectified Buck MOSFET Driver IC RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube
PX3516ADDGR4XTMA1 制造商:Infineon Technologies AG 功能描述:DC/DC IC - Tape and Reel 制造商:Infineon Technologies AG 功能描述:IC BUCK SYNC DRIVER DL TDSON10-2
PX3517FTMA1 制造商:Infineon Technologies AG 功能描述:LV IC - Tape and Reel